Memory module system and method
View Patent ↗Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.
1. A circuit module comprised of:
a flex circuit having a main body with first and second sides, said first side of the flex circuit having first and second sets of multiple circuit mounting areas on which are disposed integrated circuits of a first type which have a profile thickness of HM and the flex circuit exhibiting a perimeter defined by two opposing short sides (PEshort) and two opposing long sides (PElong) to manifest a configuration of approximately rectangular shape, the flex circuit having a peninsular area set off from the main body of the flex circuit by separations, said peninsular area not extending beyond the perimeter of the flex circuit and having on the first side of the flex circuit, a peninsular circuit mounting area having thereon disposed an integrated circuit of a second type having a profile thickness different than HM;
a rigid substrate about which said flex circuit is folded to place both the integrated circuits of the first type disposed on the first and second multiple circuit mounting areas of the first side of the flex circuit adjacent to the rigid substrate and the integrated circuit of the second type mounted on the peninsular circuit mounting area.
2. The circuit module of claim 1 in which the integrated circuit of the second type has a profile thickness which is less than HM.
3. The circuit module of claim 1 in which the integrated circuit of the second type has a profile thickness which is greater than HM.
4. The circuit module of claim 1 in which the rigid substrate is comprised of metallic material.
5. The circuit module of claim 1 in which the integrated circuit of the second type is in contact with the rigid substrate.
6. The circuit module of claim 1 in which the integrated circuits of the first type are in contact with the rigid substrate.
7. The circuit module of claim 1 in which the integrated circuits of the first type are memory circuits.
8. The circuit module of claim 1 in which the integrated circuit of the second type is a control circuit.
9. The circuit module of claim 1 in which the integrated circuit of the second type is a buffer circuit.