IP Library › Assignment 012202/0538
Patent Assignment
Reel/Frame 012202/0538

Assignment of Assignor's Interest

Recorded: 2001-09-25 Pages: 2
Assignors
ISHII, TOSHIAKI
Executed: 2001-08-30
KOKAKU, HIROYOSHI
Executed: 2001-08-30
NAGAI, AKIRA
Executed: 2001-08-30
MIWA, TAKAO
Executed: 2001-08-30
Assignee
HITACHI, LTD.
CHIYODA-KU, 6, KANDA SURUGADAI 4-CHOME, TOKYO, 101-8, JAPAN
Covered Property (1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same
Patent: 6,878,448 →
Application: 09/961,746 →
Publication: US 2002/0146565
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014547/0428 →
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →