Patent Assignment
Reel/Frame 012220/0714
Assignment of Assignor's Interest
Recorded: 2001-09-28
Received: 2001-10-10
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor device with multi-layer wiring and reduced capacitance and manufacturing method thereof
Application:
09/964,499 →