Assignment of Assignor's Interest

Recorded: 2001-10-16 Received: 2001-10-24 Pages: 3

Assignors

LEE, JAE-DONG

Executed: 2001-09-20

LEE, JONG-WON

Executed: 2001-09-20

YOON, BO-UN

Executed: 2001-09-20

HAH, SANG-ROK

Executed: 2001-09-21

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KRX, KOREA, REPUBLIC OF

Covered Properties (2)

Wafer Polishing Slurry and Chemical Mechanical Polishing (Cmp) Method Using the Same

Application: 09/977,239 →

Holding Device for Holding a Container and a Method for Fixing a Container

Application: 09/869,670 →