IP Library › Granted Patent US 6,514,862
Granted Patent Utility
US 6,514,862 · Confirmation No. 3654

WAFER POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING (CMP) METHOD USING THE SAME

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2001-10-16 TRNA Transmittal of New Application 3 View
2001-10-16 TRNA Transmittal of New Application 1 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 A.PE Preliminary Amendment 3 View
2001-10-16 SPEC Specification 3 View
2001-10-16 SPEC Specification 3 View
2001-10-16 SPEC Specification 3 View
2001-10-16 SPEC Specification 3 View
2001-10-16 CLM Claims 3 View
2001-10-16 CLM Claims 2 View
2001-10-16 ABST Abstract 1 View
2001-10-16 DRW Drawings-only black and white line drawings 2 View
2001-10-16 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,514,862
App. No.
09/977,239
Filed
2001-10-16
Granted
2003-02-04
Pub. No.
US20020064955A1
Art Unit
2818
PTA
0 days