Patent Assignment
Reel/Frame 012270/0218
Assignment of Assignor's Interest
Recorded: 2001-10-17
Pages: 3
Assignors
NAM, HYUNG-WOO
Executed: 2001-10-05
CHOO, DAE-HO
Executed: 2001-10-05
JEON, BAEK-KYUN
Executed: 2001-10-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Cutting a Non-Metal Substrate by Using a Laser Beam
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.