Patent Assignment
Reel/Frame 012271/0444
Assignment of Assignor's Interest
Recorded: 2001-10-15
Pages: 3
Assignor
DERDERIAN, JAMES M.
Executed: 2001-09-13
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Property
(1)
Assemblies Including Stacked Semiconductor Devices Separated a Distance Defined by Adhesive Material Interposed Therebetween, Packages Including the Assemblies, and Methods
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.