IP Library Assignment 012290/0786
Patent Assignment
Reel/Frame 012290/0786

Assignment of Assignor's Interest

Recorded: 2001-10-29 Received: 2001-11-02 Pages: 3
Assignors
NISHIMURA, HIDETOMO
Executed: 2001-10-09
HARADA, YASUKA
Executed: 2001-10-11
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Method for Manufacturing Semiconductor Device Having a Multi-Layer Interconnection
Application: 09/984,321 →