Patent Assignment
Reel/Frame 012290/0786
Assignment of Assignor's Interest
Recorded: 2001-10-29
Received: 2001-11-02
Pages: 3
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device Having a Multi-Layer Interconnection
Application:
09/984,321 →