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App. No. 09/984,321 · Confirmation No. 2004

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING A MULTI-LAYER INTERCONNECTION

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2002-01-28 TRNA Transmittal of New Application 2 View
2002-01-28 DRW Drawings-only black and white line drawings 8 View
2001-10-29 TRNA Transmittal of New Application 4 View
2001-10-29 SPEC Specification 16 View
2001-10-29 CLM Claims 4 View
2001-10-29 ABST Abstract 1 View
2001-10-29 DRW Drawings-only black and white line drawings 8 View
2001-10-29 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/984,321
Filed
2001-10-29
Granted
2002-11-05
Pub. No.
US20020072221A1
Art Unit
2812
PTA
0 days