IP Library › Assignment 012317/0443
Patent Assignment
Reel/Frame 012317/0443

Assignment of Assignor's Interest

Recorded: 2001-11-21 Pages: 3
Assignors
YASUOKA, HIDEKI
Executed: 2001-09-23
KOUKETSU, MASAMI
Executed: 2001-09-23
ISHIDA, SUSUMU
Executed: 2001-09-23
SAITOU, KAZUNARI
Executed: 2001-09-28
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI DEVICE ENGINEERING CO., LTD.
MOBARA-SHI, 3681, HAYANO, CHIBA, JAPAN
Covered Property (1)
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Patent: 6,780,717 →
Application: 09/989,061 →
Publication: US 2002/0064917
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0027 →
Assignment of Assignor's Interest Jul 10, 2006
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017905/0401 →
Change of Name Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →