Patent Assignment
Reel/Frame 017905/0401
Assignment of Assignor's Interest
Recorded: 2006-07-10
Pages: 11
Assignor
HITACHI DEVICE ENGINEERING CO., LTD.
Executed: 2003-06-01
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(2)
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Application:
10/327,859 →
Publication:
US 2003/0104671
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 21, 2001
From: YASUOKA, HIDEKI; KOUKETSU, MASAMI; ISHIDA, SUSUMU; SAITOU, KAZUNARI
To: HITACHI, LTD.; HITACHI DEVICE ENGINEERING CO., LTD.
Reel/Frame 012317/0443 →
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0027 →
Change of Name
Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger
Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →