IP Library Assignment 012330/0514
Patent Assignment
Reel/Frame 012330/0514

Assignment of Assignor's Interest

Recorded: 2001-11-28 Pages: 3
Assignors
RUMER, CHRISTOPHER L.
Executed: 2001-11-11
HOULE, SABINA J.
Executed: 2001-11-07
Assignee
INTEL CORP.
SC4-202,, 2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Methods to Compensate for Stress Between Heat Spreader and Thermal Interface Material
Patent: 6,748,350 →
Application: 09/963,438 →
Publication: US 2003/0058620
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 8, 2016
From: INTEL CORPORATION
To: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
Reel/Frame 037733/0440 →