Patent Assignment
Reel/Frame 012335/0784
Assignment of Assignor's Interest
Recorded: 2001-11-27
Pages: 3
Assignors
KIM, JAE-HAK
Executed: 2001-11-15
SHIN, HONG-JAE
Executed: 2001-11-15
LEE, SOO-GEUN
Executed: 2001-11-15
LEE, KYOUNG-WOO
Executed: 2001-11-15
Assignee
SAMSUNG ELECTRONICS, CO., LTD.
SUWON-CITY, 416, MAETAN-DONG, PALDAL-GU, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Devices Having Low Dielectric Interlayer Insulation Layer