Patent Assignment
Reel/Frame 012340/0917
Assignment of Assignor's Interest
Recorded: 2001-11-29
Pages: 2
Assignor
MURAKAMI, TOMOO
Executed: 2001-11-15
Assignee
NEC CORPORATION
7-1 SHIBA 5 CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Mounting Flip Chip on Circuit Board Through Reliable Electrical Connections at Low Contact Resistance
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.