IP Library › Assignment 012344/0280
Patent Assignment
Reel/Frame 012344/0280

Assignment of Assignor's Interest

Recorded: 2001-12-06 Pages: 2
Assignors
TOMITA, SHINICHI
Executed: 2001-10-11
TSUDA, SHUHEI
Executed: 2001-10-11
IKEDA, YASUNOBU
Executed: 2001-10-11
Assignee
SUMITOMO METAL INDUSTRIES, INC.
5-33, KITAHAMA 5-CHOME, CHUO-KU, OSAKA-SHI, OSAKA 541-0041, JAPAN
Covered Property (1)
Method for Bonding Substrates
Patent: 6,620,285 →
Application: 09/972,851 →
Publication: US 2002/0040754
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 5, 2002
From: SUMITOMO METAL INDUSTRIES, LTD.
To: SUMITOMO MITSUBISHI SILICON CORPORATION
Reel/Frame 013060/0349 →