IP Library › Granted Patent US 6,620,285
Granted Patent Utility
US 6,620,285 · Confirmation No. 5581

METHOD FOR BONDING SUBSTRATES

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2003-06-27 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-06-27 FRPR Certified Copy of Foreign Priority Application 29 View
2003-06-27 FRPR Certified Copy of Foreign Priority Application 31 View
2003-06-27 LET. Miscellaneous Incoming Letter 1 View
2001-12-05 SPEC Specification 15 View
2001-12-05 CLM Claims 3 View
2001-12-05 ABST Abstract 1 View
2001-12-05 OATH Oath or Declaration filed 2 View
2001-10-10 TRNA Transmittal of New Application 2 View
2001-10-10 SPEC Specification 14 View
2001-10-10 DRW Drawings-only black and white line drawings 6 View
2001-10-10 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,620,285
App. No.
09/972,851
Filed
2001-10-10
Granted
2003-09-16
Pub. No.
US20020040754A1
Art Unit
1734
PTA
-82 days