Patent Assignment
Reel/Frame 012346/0284
Assignment of Assignor's Interest
Recorded: 2001-10-09
Pages: 4
Assignors
TSUJI, HIROYUKI
Executed: 2001-10-04
FURUTANI, HIROYUKI
Executed: 2001-10-04
TANAKA, KOICHIRO
Executed: 2001-10-04
KIKUCHI, TAKESHI
Executed: 2001-10-04
Assignee
KANEKA JAPAN CORPORATION
2-4, NAKANOSHIMA, 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-0005, JAPAN
Covered Property
(1)
Polyimide Resin and Resin Composition, Adhesive Solution, Film-State Joining Component,and Adhesive Laminate Film Improved in Moisture Resistance Using It,and Production Methods Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.