Patent Assignment
Reel/Frame 014670/0188
Assignment of Assignor's Interest
Recorded: 2003-11-12
Pages: 3
Assignors
TSUJI, HIROYUKI
Executed: 2003-10-30
FURUTANI, HIROYUKI
Executed: 2003-10-31
TANAKA, KOICHIRO
Executed: 2003-11-04
KIKUCHI, TAKESHI
Executed: 2003-10-30
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME KITA-KU, OSAKA-SHI, OSAKA, 530-0005, JAPAN
Covered Property
(1)
Polyimide Resin and Resin Composition, Adhesive Solution, Film-State Joining Component,and Adhesive Laminate Film Improved in Moisture Resistance Using It,and Production Methods Therefor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.