Patent Assignment
Reel/Frame 012362/0390
Assignment of Assignor's Interest
Recorded: 2001-12-10
Received: 2001-12-17
Pages: 2
Assignor
FURUYA, AKIRA
Executed: 2001-11-27
Assignee
NEC CORPORATION
MINATO-KU, 7-1 SHIBA 5-CHOME, TOKYO 108-01, JPX, JAPAN
Covered Property
(1)
Method for Forming Barrier Layers for Solder Bumps
Application:
10/006,367 →