IP Library › Patent Application 10006367
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App. No. 10/006,367 · Confirmation No. 1651

METHOD FOR FORMING BARRIER LAYERS FOR SOLDER BUMPS

Inventor: Akira Furuya
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-12-10 TRNA Transmittal of New Application 2 View
2001-12-10 ADS Application Data Sheet 1 View
2001-12-10 A.PE Preliminary Amendment 2 View
2001-12-10 SPEC Specification 15 View
2001-12-10 CLM Claims 4 View
2001-12-10 ABST Abstract 1 View
2001-12-10 DRW Drawings-only black and white line drawings 3 View
2001-12-10 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/006,367
Filed
2001-12-10
Granted
2003-09-02
Pub. No.
US20020072215A1
Art Unit
2822
PTA
-91 days