Patent Assignment
Reel/Frame 013622/0981
Assignment of Assignor's Interest
Recorded: 2003-05-02
Received: 2003-05-02
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(10)
Semiconductor Device and Method for Manufacturing the Same
Application:
10/196,430 →
Photo Mask for Fabricating Semiconductor Device Having Dual Damascene Structure
Application:
10/112,716 →
Phase-Shifting Mask and Method of Forming Pattern Using the Same
Application:
10/061,283 →
Method for Forming Barrier Layers for Solder Bumps
Application:
10/006,367 →
Manufacturing method of semiconductor device
Application:
09/992,027 →
Pattern forming method
Application:
09/987,928 →
Hcv Antigen/Antibody Combination Assay
Application:
09/881,239 →
Immunoassays for Anti-Hcv Antibodies
Application:
09/881,654 →
Semiconductor device with multiple emitter contact plugs
Application:
09/841,115 →
Semiconductor device with capacitive element and method of forming the same
Application:
09/774,041 →