Patent Assignment
Reel/Frame 012382/0219
Assignment of Assignor's Interest
Recorded: 2001-12-11
Received: 2001-12-26
Pages: 3
Assignors
HIDAKA, HIROSHI
Executed: 2001-11-15
INAO, HISAHO
Executed: 2001-11-15
OGA, AKIRA
Executed: 2001-11-15
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JPX, JAPAN
Covered Property
(1)
Lead Frame and Method for Fabricating Resin-Encapsulated Semiconductor Device
Application:
10/011,704 →