IP Library › Granted Patent US 6,645,792
Granted Patent Utility
US 6,645,792 · Confirmation No. 1839

LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2003-07-23 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-16 LET. Miscellaneous Incoming Letter 2 View
2003-07-16 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2003-07-16 FOR Foreign Reference 7 View
2003-07-16 FOR Foreign Reference 36 View
2003-07-16 FOR Foreign Reference 7 View
2003-07-16 FOR Foreign Reference 6 View
2003-07-16 FOR Foreign Reference 5 View
2001-12-11 TRNA Transmittal of New Application 2 View
2001-12-11 ADS Application Data Sheet 2 View
2001-12-11 SPEC Specification 34 View
2001-12-11 CLM Claims 5 View
2001-12-11 ABST Abstract 1 View
2001-12-11 DRW Drawings-only black and white line drawings 8 View
2001-12-11 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,645,792
App. No.
10/011,704
Filed
2001-12-11
Granted
2003-11-11
Pub. No.
US20030003628A1
Art Unit
2814
PTA
-1 days