Patent Assignment
Reel/Frame 012386/0039
Assignment of Assignor's Interest
Recorded: 2001-12-14
Pages: 3
Assignor
ROETERS, GLEN E.
Executed: 2001-12-12
Assignee
DPAC TECHNOLOGIES CORP.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property
(1)
Csp Chip Stack with Flex Circuit
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 14, 2004
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 015564/0411 →
Assignment of Assignor's Interest
Nov 20, 2006
From: ROSS, ANDREW C.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 018537/0799 →
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →