IP Library › Assignment 012419/0472
Patent Assignment
Reel/Frame 012419/0472

Assignment of Assignor's Interest

Recorded: 2001-12-28 Pages: 3
Assignor
HIRANO, YUUICHI
Executed: 2001-12-05
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property (1)
Semiconductor Device in Which Bump Used for Fixing Potential of Silicon Substrate Can Be Easily Formed
Patent: 6,657,312 →
Application: 10/028,317 →
Publication: US 2002/0130414
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 1, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024915/0526 →
Merger Sep 1, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024915/0556 →