Patent Assignment
Reel/Frame 012426/0298
Assignment of Assignor's Interest
Recorded: 2002-01-03
Pages: 2
Assignors
OR, SIU WING
Executed: 2001-11-15
ZHU, HONGHAI
Executed: 2001-11-15
WONG, YAM MO
Executed: 2001-11-15
NG, HONYU
Executed: 2001-11-15
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD., A CORP. OF SINGAPORE
2 YISHUN AVENUE 7, SINGAPORE 768924, SINGAPORE
Covered Property
(1)
Method of Bonding Wires
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2010
From: ASM TECHNOLOGY SINGAPORE PTE. LTD.
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 024233/0247 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →