IP Library › Assignment 012457/0642
Patent Assignment
Reel/Frame 012457/0642

Assignment of Assignor's Interest

Recorded: 2002-01-08 Pages: 3
Assignors
MORINAGA, YUICHI
Executed: 2001-12-26
HASEGAWA, KIYOSHI
Executed: 2001-12-26
FUCHINOUE, KENJI
Executed: 2001-12-26
Assignee
OKI ELECTRIC INDUSTRY CO., LTD
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105, JAPAN
Covered Property (1)
Multi-Chip Package-Type Semiconductor Device
Patent: 6,518,655 →
Application: 09/975,198 →
Publication: US 2002/0047214
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 12, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022408/0397 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →