IP Library Assignment 012470/0595
Patent Assignment
Reel/Frame 012470/0595

Assignment of Assignor's Interest

Recorded: 2001-11-16 Pages: 11
Assignors
POO, CHIA YONG
Executed: 2001-10-05
JEUNG, BOON SUAN
Executed: 2001-10-05
WAF, LOW SIU
Executed: 2001-10-05
YU, CHAN MIN
Executed: 2001-10-05
LOO, NEO YONG
Executed: 2001-10-05
KWANG, CHUA SWEE
Executed: 2001-10-05
Assignee
MICRON TECHNOLOGY, INC.
LEGAL DEPT., M/S 525, 8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83706
Covered Property (1)
Wafer Level Stackable Semiconductor Package
Patent: 6,611,052 →
Application: 10/042,560 →
Publication: US 2003/0094683
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →