Patent Assignment
Reel/Frame 012471/0273
Assignment of Assignor's Interest
Recorded: 2001-12-05
Received: 2002-01-22
Pages: 3
Assignor
TSAO, CHUN-CHENG
Executed: 2001-07-17
Assignee
SCHLUMBERGER TECHNOLOGIES, INC.
150 BAYTECH DRIVE, SAN JOSE, CA, 95134, UNITED STATES
Covered Property
(1)
Method for Global Die Thinning and Polishing of Flip-Chip Packaged Integrated Circuits
Application:
09/924,736 →