Patent Assignment
Reel/Frame 012518/0718
Assignment of Assignor's Interest
Recorded: 2002-01-23
Pages: 2
Assignor
KIM, CHAE-SUNG
Executed: 2001-11-07
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-UEP, ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor and Method for Fabricating the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Assignment of Assignor's Interest
Jun 24, 2009
From: KIM, CHAE SUNG
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 022856/0952 →