Assignment of Assignor's Interest

Recorded: 2002-01-22 Received: 2002-02-05 Pages: 3

Assignors

HUANG, CHING-CHENG

Executed: 2002-01-17

LEE, JIN-YUAN

Executed: 2002-01-17

LIN, MOU-SHIUNG

Executed: 2002-01-17

Assignee

MEGIC CORPORATION

21 R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCU, TWX, R.O.C, TAIWAN

Covered Property (1)

Integrated Chip Package Structure Using Ceramic Substrate and Method of Manufacturing the Same

Application: 10/055,498 →