IP Library › Patent Application 10055498
Patent Application Utility
App. No. 10/055,498 · Confirmation No. 7450

INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2013-07-11 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2013-07-11 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2013-05-29 PA.. Power of Attorney 1 View
2013-05-29 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-05-29 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-04-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-04-01 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-03-23 PA.. Power of Attorney 1 View
2011-03-23 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-03-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-03-23 TRAN.LET Transmittal Letter 1 View
2011-03-23 LET. Miscellaneous Incoming Letter 1 View
2006-08-14 PA.. Power of Attorney 2 View
2006-08-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2004-08-16 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-01-22 TRNA Transmittal of New Application 2 View
2002-01-22 SPEC Specification 21 View
2002-01-22 CLM Claims 28 View
2002-01-22 ABST Abstract 1 View
2002-01-22 DRW Drawings-only black and white line drawings 17 View
2002-01-22 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/055,498
Filed
2002-01-22
Granted
2004-10-05
Pub. No.
US20030124767A1
Art Unit
2824
PTA
0 days