Patent Assignment
Reel/Frame 012528/0576
Assignment of Assignor's Interest
Recorded: 2002-01-23
Received: 2002-02-05
Pages: 3
Assignors
PETRARCA, KEVIN SHAWN
Executed: 2001-12-13
PURUSHOTHAMAN, SAMPATH
Executed: 2001-12-13
MAGERLEIN, JOHN HAROLD
Executed: 2001-12-14
WALKER, GEORGE FREDERICK
Executed: 2001-12-14
SAMBUCETTI, CARLOS JUAN
Executed: 2001-12-17
VOLANT, RICHARD PAUL
Executed: 2001-12-18
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
ARMONK, NY, 10504, UNITED STATES
Covered Property
(1)
High Density Area Array Solder Microjoining Interconnect Structure and Fabrication Method
Application:
10/052,620 →