IP Library › Granted Patent US 6,661,098
Granted Patent Utility Small
US 6,661,098 · Confirmation No. 3113

HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2025-10-20 OATH Oath or Declaration filed 52 View
2025-07-15 OATH Oath or Declaration filed 63 View
2025-06-16 OATH Oath or Declaration filed 43 View
2022-11-14 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2015-02-26 SES.REQ Assertion of entitlement to small entity status 1 View
2003-10-08 IFEE Issue Fee Payment (PTO-85B) 2 View
2002-01-18 TRNA Transmittal of New Application 2 View
2002-01-18 SPEC Specification 6 View
2002-01-18 CLM Claims 4 View
2002-01-18 ABST Abstract 1 View
2002-01-18 DRW Drawings-only black and white line drawings 3 View
2002-01-18 OATH Oath or Declaration filed 5 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,661,098
App. No.
10/052,620
Filed
2002-01-18
Granted
2003-12-09
Pub. No.
US20030137058A1
Examiner
NHU, DAVID
Art Unit
2818
PTA
0 days