Patent Assignment
Reel/Frame 071649/0225
Security Interest
Recorded: 2025-06-16
Pages: 43
Assignor
VEECO INSTRUMENTS INC.
Executed: 2025-06-16
Assignee
HSBC BANK USA, NATIONAL ASSOCIATION
ATTN: DAC POST CLOSE, 239 VAN RENSSELAER STREET, BUFFALO, NEW YORK, 14210
Covered Properties
(237)
Pulsed Operation of Hall-Current Ion Sources
Patent:
6,870,164 →
Application:
09/689,476 →
Machine-Independent Alignment System and Method
Patent:
6,898,306 →
Application:
09/855,485 →
High Density Interconnects
Method for Forming Solder Connections on a Circuitized Substrate
Reactor Having a Movable Shutter
High Density Raised Stud Microjoining System and Methods of Fabricating the Same
High Density Area Array Solder Microjoining Interconnect Structure and Fabrication Method
Goniometer
Method and Structure for Joining Two Substrates with a Low Melt Solder Joint
Patent:
6,583,517 →
Application:
10/119,491 →
Method and Apparatus for Controlling Film Profiles on Topographic Features
Patent:
6,716,322 →
Application:
10/126,928 →
Smt Passive Device Noflow Underfill Methodology and Structure
Method of Forming a Lead-Free Tin-Silver-Copper Based Solder Alloy on an Electronic Substrate.
Patent:
6,596,621 →
Application:
10/151,075 →
Ball Grid Array Module and Method of Manufacturing Same
Dual Chamber Integrated Phase Separator for Ultra High Vacuum System
Negative Volume Expansion Lead-Free Electrical Connection
Patent:
6,649,833 →
Application:
10/215,451 →
Dual-Solder Flip-Chip Solder Bump
Lead-Free Alloys for Column/Ball Grid Arrays, Organic Interposers and Passive Component Assembly
Selective C4 Connection in Ic Packaging
Patent:
6,650,016 →
Application:
10/262,753 →
Multi-Layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric
Laser Scanning Apparatus and Methods for Thermal Processing
Large-Field Unit-Magnification Projection System
Variable Numerical Aperture Large-Field Unit-Magnification Projection System
Selective Filling of Electrically Conductive Vias for Three Dimensional Device Structures
Method and System for Laser Thermal Processing of Semiconductor Devices
Patent:
6,844,250 →
Application:
10/390,504 →
Deep Ultraviolet Unit-Magnification Projection Optical System and Projection Exposure Apparatus
Improvements in Grounding and Thermal Dissipation for Integrated Circuit Packages
Laser Thermal Processing with Laser Diode Radiation
Laser Thermal Annealing of Lightly Doped Silicon Substrates
High Density Area Array Solder Microjoining Interconnect Structure and Fabrication Method
Laser Thermal Annealing of Lightly Doped Silicon Substrates
Charged Particle Source and Operation Thereof
Laser Scanning Apparatus and Methods for Thermal Processing
Method and Apparatus for Surface Processing of a Substrate
High Na Large-Field Unit-Magnification Projection Optical System
Patent:
7,116,496 →
Application:
10/976,971 →
Apochromatic Unit-Magnification Projection Optical System
Bridge Row Tool
Patent:
8,066,547 →
Application:
10/993,017 →
Heated Chuck for Laser Thermal Processing
Deep Ultraviolet Unit-Magnification Projection Optical System and Projection Exposure Apparatus
Fluid-Cooled Ion Source
Heat Shield for Thermal Processing
Method and Apparatus for Measuring the Curvature of Reflective Surfaces
Reactor Having a Movable Shutter
Vapor Deposition Systems and Methods
Grid Transparency and Grid Hole Pattern Control for Ion Beam Uniformity
Laser Thermal Annealing of Lightly Doped Silicon Substrates
Density-matching alkyl push flow for vertical flow rotating disk reactors
Ion Sources and Methods for Generating an Ion Beam with a Controllable Ion Current Density Distribution
Method of Removing Metallic, Inorganic and Organic Contaminants from Chip Passivation Layer Surfaces
Apparatus for Cathodic Vacuum-Arc Coating Deposition
Silicon Germanium Heterojunction Bipolar Transistor Structure and Method
Minimal Force Air Bearing for Lapping Tool
Patent:
7,871,306 →
Application:
11/744,874 →
Methods of Forming a Denuded Zone in a Semiconductor Wafer Using Rapid Laser Annealing
Methods and Apparatus for Temperature Measurement and Control on a Remote Substrate Surface
Patent:
7,744,274 →
Application:
11/820,558 →
Thermally Isolated Cryopanel for Vacuum Deposition Systems
Adaptive Controller for Ion Source
Gas Treatment Systems
Methods of Operating an Electromagnet of an Ion Source
Method and Apparatus for Surface Processing of a Substrate Using an Energetic Particle Beam
Dual-Sided Substrate Measurement Apparatus and Methods
Patent:
7,902,040 →
Application:
12/286,762 →
Activating Dopants Using Multiple Consecutive Millisecond-Range Anneals
Vacuum Deposition Sources Having Heated Effusion Orifices
Electrical Contacts for Use with Vacuum Deposition Sources
Reaction Chamber with Removable Liner
System and Method for Thin Film Deposition
Method for Improving Performance of a Substrate Carrier
Chemical Vapor Deposition Flow Inlet Elements and Methods
Through Silicon via Lithographic Alignment and Registration
Deposition of High Vapor Pressure Materials
Grid Transparency and Grid Hole Pattern Control for Ion Beam Uniformity
Exhaust for Cvd Reactor
Grid Providing Beamlet Steering
Fault Tolerant Ion Source Power System
Gas Treatment Systems
Processing Methods and Apparatus with Temperature Distribution Control
Gas Injection System for Chemical Vapor Deposition Using Sequenced Valves
Wafer Carrier with Sloped Edge
Activating Gan Leds by Laser Spike Annealing and Flash Annealing
Ald Systems and Methods
Vapor Deposition Systems and Methods
Methods and Systems for in-Situ Pyrometer Calibration
Wafer Processing with Carrier Extension
Apparatus and Method for Improving the Intensity Profile of a Beam Image Used to Process a Substrate
Patent:
8,742,286 →
Application:
13/354,300 →
Two-Beam Laser Annealing with Improved Temperature Performance
Substrate-Alignment Using Detector of Substrate Material
Patent:
44,116 →
Application:
13/366,199 →
Keyed Wafer Carrier
Ion Sources and Methods for Generating an Ion Beam with Controllable Ion Current Density Distribution
Wafter Carrier for Chemical Vapor Deposition Systems
Heated Wafer Carrier Profiling
Radiation Thermometer Using Off-Focus Telecentric Optics
Control of Stray Radiation in a Cvd Chamber
Film Deposition Assisted by Angular Selective Etch on a Surface
Terminal for Mechanical Support of a Heating Element
LED-based photolithographic illuminator with high collection efficiency
Movable microchamber system with gas curtain
Apparatus and Method for Improved Acoustical Transformation
Dual-Loop Control for Laser Annealing of Semiconductor Wafers
Patent:
8,691,598 →
Application:
13/706,397 →
Electrical Contacts for Use with Vacuum Deposition Sources
Self-Cleaning Shutter for Cvd Reactor
System and Method for Performing a Wet Etching Process
TEMPERATURE CONTROL FOR GaN BASED MATERIALS
Wafer Carrier Having Provisions for Improving Heating Uniformity in Chemical Vapor Deposition Systems
Apparatus and Method to Remove Undissolved Solids from Post Process Dry Film Strip Solvents
Unit magnification large-format catadioptric lens for microlithography
Laser Annealing Systems and Methods with Ultra-Short Dwell Times
Substrate Processing with Reduced Warpage and/or Controlled Strain
Method For Improving Performance Of A Substrate Carrier
Methods of laser processing photoresist in a gaseous environment
Two-Beam Laser Annealing with Improved Temperature Performance
Chemical Vapor Deposition Flow Inlet Elements and Methods
Wynne-Dyson projection lens with reduced susceptibility to UV damage
Systems and methods for reducing beam instability in laser annealing
Bellows-Free Retractable Vacuum Deposition Sources
Wynne-Dyson optical system with variable magnification
Apparatus for Dual Speed Spin Chuck
Collection Chamber Apparatus to Separate Multiple Fluids During the Semiconductor Wafer Processing Cycle
Laser Annealing Systems and Methods with Ultra-Short Dwell Times
Wafer Carrier Having Thermal Cover for Chemical Vapor Deposition Systems
Wafer Carrier Having Retention Pockets with Compound Radii for Chemical Vapor Desposition Systems
Method for Increased Target Utilization in Ion Beam Deposition Tools
Control of Stray Radiation In A CVD Chamber
High-efficiency line-forming optical systems and methods
Enhanced Enclosures for Acoustical Gas Concentration Sensing and Flow Control
Apparatus and Method to Reduce and Control Resistivity of Deionized Water
Apparatus and Method for Metals Free Reduction and Control of Resistivity of Deionized Water
Ion Beam Etching of Stt-Ram Structures
Method of Etching the Back of a Wafer to Expose Tsvs
High-Efficiency Line-Forming Optical Systems and Methods for Defect Annealing and Dopant Activation
Laser Annealing Systems and Methods with Ultra-Short Dwell Times
Method For Improving Performance Of A Substrate Carrier
Plasma Enhanced Ald System
Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing
Processing Methods and Apparatus with Temperature Distribution Control
Apparatus and Method for Mixing Fluids with Degradational Properties
Methods of Wafer Processing with Carrier Extension
Ion Sources and Methods for Generating Ion Beams with Controllable Ion Current Density Distributions Over Large Treatment Areas
Self-Centering Wafer Carrier System for Chemical Vapor Deposition
High-efficiency line-forming optical systems and methods using a serrated spatial filter
Seal for Wafer Processing Assembly
Methods of forming an ALD-inhibiting layer using a self-assembled monolayer
Rotating Disk Reactor with Ferrofluid Seal for Chemical Vapor Deposition
Periphery Purge Shutter and Flow Control Systems and Methods
Gas Concentration Sensors and Systems
Apparatus and Method to Control Properties of Fluid Discharge Via Refrigerative Exhaust
Apparatus and Method to Control Etch Rate Through Adaptive Spiking of Chemistry
Collection Chamber Apparatus to Separate Multiple Fluids During the Semiconductor Wafer Processing Cycle
Ion Beam Materials Processing System with Grid Short Clearing System for Gridded Ion Beam Source
Ion Beam Etching
Formation of Heteroepitaxial Layers with Rapid Thermal Processing to Remove Lattice Dislocations
Two-level Tape Frame Rinse Assembly
Filter Element for Wafer Processing Assembly
Wafer Chuck Apparatus With Micro-Channel Regions
Scanning Methods for Focus Control for Lithographic Processing of Reconstituted Wafers
Apparatus and Method to Remove Solids from Material Lift Off Post Process Solvents
Chuck Systems and Methods Having Enhanced Electrical Isolation For Substrate-Biased ALD
Apparatus and Method for Wafer Thinning in Advanced Packaging Applications
Laser-Assisted Atomic Layer Deposition of 2D Metal Chalcogenide Films
Method and Apparatus for Forming Device Quality Gallium Nitride Layers on Silicon Substrates
Semiconductor Wafer Processing Chamber
Alkyl Push Flow for Vertical Flow Rotating Disk Reactors
Two Etch Method for Achieving a Wafer Thickness Profile
Laser-Based Systems and Methods for Melt-Processing of Metal Layers in Semiconductor Manufacturing
Laser Annealing Systems and Methods With Ultra-Short Dwell Times
Wafer Carrier Having Retention Pockets with Compound Radii for Chemical Vapor Deposition Systems
Chemical Vapor Deposition Apparatus with Multi-Zone Injection Block
High Pressure Spray Head
System and Method for Self-Cleaning Wet Treatment Process
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process
High-Efficiency Line-Forming Optical Systems and Methods Using A Serrated Spatial Filter
Micro-LED Transfer Methods Using Light-Based Debonding
Semiconductor Wafer Processing Chamber
Application:
16/656,037 →
Publication:
US 2020/0161146
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process
Rotating Disk Reactor with Self-Locking Carrier-to-Support Interface for Chemical Vapor Deposition
Application:
16/752,661 →
Publication:
US 2020/0248307
CVD Reactor Single Substrate Carrier and Rotating Tube for Stable Rotation
Application:
16/868,082 →
Publication:
US 2021/0095374
Deposition System with Integrated Carrier Cleaning Modules
Melt Detection Systems and Methods of Using the Same
Enhanced Cathodic Arc Source for Arc Plasma Deposition
Molecular Beam Epitaxy Systems with Variable Substrate-to-Source Arrangements
Application:
17/074,350 →
Publication:
US 2021/0115588
Apparatus and Method for Die Stack Flux Removal
Ion Beam Deposition of a Low Resistivity Metal
Application:
17/197,885 →
Publication:
US 2021/0292889
Automated Batch Production Thin Film Deposition Systems and Methods of Using the Same
Reactor with Centering Pin for Epitaxial Deposition
Wafer Carrier Assembly with Pedestal and Cover Restraint Arrangements That Control Thermal Gaps
Application:
17/462,990 →
Publication:
US 2023/0060609
Ion Beam Deposition of a Low Resistivity Metal
Application:
17/475,027 →
Publication:
US 2021/0404051
Rotating Disk Reactor with Split Substrate Carrier
Application:
17/717,679 →
Publication:
US 2022/0243325
Laser Spike Annealing Process Temperature Calibration Utilizing Photoluminescence Measurements
Application:
18/107,870 →
Publication:
US 2023/0268233
Scatter Melt Detection to Determine Phase Transition of Semiconductor During Laser Annealing
Wafer Carrier Assembly with Improved Temperature Uniformity
Application:
18/365,629 →
Publication:
US 2024/0102166
Ion Beam Deposition of Ruthenium Thin Films
Application:
18/467,549 →
Publication:
US 2024/0102150
Lightpipe for High Temperature Substrate Processing
Application:
18/489,460 →
Publication:
US 2024/0142310
Grid Surface Conditioning for Ion Beam System
Application:
18/504,438 →
Publication:
US 2024/0203683
Multi-Disc Chemical Vapor Deposition System with Cross Flow Gas Injection
Application:
18/519,548 →
Publication:
US 2024/0175133
Ion Beam Deposition of a Low Resistivity Metal
Application:
18/522,193 →
Publication:
US 2024/0093356
Integrated Synchronous System for Gridded Ion Sources
Application:
18/661,315 →
Publication:
US 2024/0387142
Plasma Vessel Cleaning for Ion Beam System
Application:
18/786,227 →
Publication:
US 2025/0046586
Deposition System with Integrated Carrier Cleaning Modules
Application:
18/824,461 →
Publication:
US 2024/0425973
Chemical Vapor Deposition System with Hot-Wall Hybrid Flow Reactor and Removable Reactor Floor
Application:
18/899,637 →
Publication:
US 2025/0109493
Electrical Isolation of Gas Feed for Ion Beam System
Application:
19/012,247 →
Publication:
US 2025/0226176
Low Resistivity Tungsten Interconnect Structures
Application:
19/023,213 →
Publication:
US 2025/0233073
Electrostatic Chuck for Ion Beam Deposition Systems
Application:
19/052,193 →
Publication:
US 2025/0266233
Flared Shutter Liner for Chemical Vapor Deposition System
Application:
19/052,607 →
Publication:
US 2025/0263837
In-Situ Pyrometer for Silicon Carbide Wafer
Application:
19/095,469 →
Publication:
US 2025/0305182
Gas Injectors for Mocvd/Cvd Systems
Application:
19/098,317 →
Publication:
US 2025/0313954
An Apparatus for Semiconductor Solvent Processing Utilized for 3D and Traditional Process Flows
Application:
19/171,798 →
Publication:
US 2025/0323065
Apparatus for Improved Material Lift Off (Mlo)Semiconductor Processing
Application:
19/174,188 →
Publication:
US 2025/0323068
Uv Assisted Strip (Uvas) of Photoresist to Realize Esg and 3D Integration Targets
Application:
19/183,129 →
Publication:
US 2025/0328079
Keyed Spindle
Patent:
726,133 →
Application:
29/416,216 →
Spindle Key
Patent:
712,852 →
Application:
29/416,217 →
Keyed Wafer Carrier
Patent:
687,790 →
Application:
29/416,220 →
Wafer Carrier Having Pockets
Patent:
686,175 →
Application:
29/416,224 →
Wafer Carrier Having Pockets
Patent:
690,671 →
Application:
29/416,228 →
Multi-Keyed Wafer Carrier
Patent:
687,791 →
Application:
29/416,236 →
Wafer Carrier Having Pockets
Patent:
686,582 →
Application:
29/416,238 →
Wafer Carrier Having Pockets
Patent:
695,241 →
Application:
29/416,240 →
Wafer Carrier Having Pockets
Patent:
695,242 →
Application:
29/416,244 →
Multi-Keyed Spindle
Patent:
711,332 →
Application:
29/416,253 →
Gas Injection Plate
Patent:
732,092 →
Application:
29/485,461 →
Gas Tube Assembly
Patent:
732,093 →
Application:
29/485,465 →
Spindle Key
Patent:
744,967 →
Application:
29/499,058 →
Keyed Spindle
Patent:
748,591 →
Application:
29/514,586 →
Wafer Carrier with a 14-Pocket Configuration
Patent:
793,971 →
Application:
29/522,212 →
Wafer Carrier with a 31-Pocket Configuration
Patent:
793,972 →
Application:
29/522,214 →
Wafer Carrier with a Multi-Pocket Configuration
Patent:
778,247 →
Application:
29/524,104 →
Self-Centering Wafer Carrier for Chemical Vapor Deposition
Patent:
819,580 →
Application:
29/559,939 →
Self-Centering Wafer Carrier For Chemical Vapor Deposition
Patent:
810,705 →
Application:
29/559,977 →
Wafer Handling Assembly
Patent:
803,283 →
Application:
29/564,740 →
Wafer Carrier with a Multi-Pocket Configuration
Patent:
806,046 →
Application:
29/587,929 →
Wafer Carrier with a 14-Pocket Configuration
Patent:
852,762 →
Application:
29/612,468 →
Wafer Carrier with a 33-Pocket Configuration
Patent:
860,146 →
Application:
29/627,938 →
Chemical Vapor Deposition Wafer Carrier with Thermal Cover
Patent:
866,491 →
Application:
29/641,924 →
Chemical Vapor Deposition Wafer Carrier with Thermal Cover
Patent:
860,147 →
Application:
29/641,927 →
Chemical Vapor Deposition Wafer Carrier with Thermal Cover
Patent:
858,469 →
Application:
29/641,930 →
Chemical Vapor Deposition Wafer Carrier with Thermal Cover
Patent:
863,239 →
Application:
29/641,931 →
Chemical Vapor Deposition Wafer Carrier with Thermal Cover
Patent:
854,506 →
Application:
29/641,933 →
Mid-Filament Spacer
Patent:
893,088 →
Application:
29/656,586 →
Transportable Semiconductor Wafer Rack
Patent:
908,102 →
Application:
29/680,872 →
Transportable Semiconductor Wafer Rack
Patent:
908,103 →
Application:
29/680,874 →
Multi-Filament Heater Assembly
Patent:
921,431 →
Application:
29/685,939 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Dec 10, 2009
From: CAMBRIDGE NANOTECH INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 023637/0808 →
Assignment of Assignor's Interest
Jul 11, 2012
From: BOGUSLAVSKIY, VADIM; MANGUM, JOSHUA; KING, MATTHEW; MARCELO, EARL
To: VEECO INSTRUMENTS INC.
Reel/Frame 028565/0336 →
Assignment of Assignor's Interest
Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →
Assignment of Assignor's Interest
Sep 13, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028959/0001 →
Release of Ip Security Interest
Dec 28, 2012
From: SILICON VALLEY BANK
To: CAMBRIDGE NANOTECH, INC.
Reel/Frame 029549/0152 →
Assignment of Assignor's Interest
Mar 25, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.; ULTRATECH, INC.
Reel/Frame 032523/0745 →
Assignment of Assignor's Interest
Aug 12, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 033519/0066 →
Corrective Assignment to Correct the Receiving Party's State of Incorporation Previously Recorded on Reel 030203 Frame 0829. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Feb 14, 2017
From: CAMBRIDGE NANOTECH, INC.
To: SURTEK, INC.
Reel/Frame 041713/0414 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Nunc Pro Tunc Assignment
Jan 3, 2022
From: VEECO COMPOUND SEMICONDUCTOR INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 058527/0151 →