IP Library › Granted Patent US 778,247
Granted Patent S1
US 778,247 · App. 29/524,104 · Granted Feb 7, 2017

Wafer carrier with a multi-pocket configuration

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Quick Facts
Patent No.
US 778,247
App. No.
29/524,104
Granted
Feb 7, 2017
Kind
S1
Claims (1)

We claim the ornamental design for a wafer carrier with a multi-pocket configuration, as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →
PATENT SECURITY AGREEMENT Recorded Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2015
From: GURARY, ALEXANDER; DESHPANDE, MANDAR; PAREKH, ANIRUDDH; RASHKOVSKY, YULIY
To: VEECO INSTRUMENTS, INC.
Reel/Frame 035433/0146 →