Patent Assignment
Reel/Frame 033519/0066
Assignment of Assignor's Interest
Recorded: 2014-08-12
Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2013-08-05
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(27)
Method for Assembling a Chip Carrier to a Semiconductor Device
Patent:
6,220,499 →
Application:
09/163,150 →
Multi-Voltageplane, Multi-Signal Plane Circuit Card with Dotoimageable Dielectric
Patent:
6,201,194 →
Application:
09/203,978 →
High Density Interconnects
Method for Forming Solder Connections on a Circuitized Substrate
Electronic Package with High Density Interconnect Layer
Smt Passive Device Noflow Underfill Methodology and Structure
Process for Making Fine Pitch Connections Between Devices and Structure Made by the Process
Selective C4 Connection in Ic Packaging
Patent:
6,650,016 →
Application:
10/262,753 →
Method of Fabricating Integrated Electronic Chip with an Interconnect Device
Semiconductor Module with Improved Interposer Structure and Method for Forming the Same
Electronic Package with Improved Current Carrying Capability and Method of Forming the Same
Methodology for Recovery of Hot Carrier Induced Degradation in Bipolar Devices
Electronic Package with Optimized Lamination Process
Smt Passive Device Noflow Underfill Methodology and Structure
Integrated Chip Carrier with Compliant Interconnect
Electronic Package with Improved Current Carrying Capability and Method of Forming the Same
Method of Reducing Detrimental Sti-Induced Stress in Mosfet Channels
Modification of Solder Alloy Compositions to Suppress Interfacial Void Formation in Solder Joints
Semiconductor Device and Method of Manufacture
Thermo-Compression Bonded Electrical Interconnect Structure and Method
Method of Forming Cmos with Si:C Source/Drain by Laser Melting and Recrystallization
Optimization of Metallurgical Properties of a Solder Joint
Flexible Printed Circuits Capable of Transmitting Electrical and Optical Signals
Elliptic C4 with Optimal Orientation for Enhanced Reliability in Electronic Packages
Thermo-Compression Bonded Electrical Interconnect Structure
Integrated Chip Carrier with Compliant Interconnects
Laser Annealing for 3-D Chip Integration
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0735 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →