Deposition system with integrated carrier cleaning modules
A chemical vapor deposition system for semiconductor wafer production is disclosed. The system includes a process cluster coupled to a first end of a transfer chamber. The process cluster is maintained at a pressure that is lower than atmospheric pressure. The process cluster is also configured to apply epitaxial layers on one or more wafers loaded onto a wafer carrier. The system also includes an automatic factory interface coupled to a second end of the transfer chamber. The automatic factory interface is maintained at atmospheric pressure. The system includes one or more wafer carrier cleaning modules coupled to the automatic factory interface and configured to clean one or more of the wafer carriers without removing the wafer carriers from the chemical vapor deposition system.
1. A chemical vapor deposition system for semiconductor wafer production, the system comprising:
a transfer chamber having a first end and a second end;
an automatic factory interface including an automatic factory interface robot and operably coupled to the first end of the transfer chamber, the automatic factory interface robot configured to load and unload one or more wafers from one or more wafer carriers;
one or more wafer carrier cleaning modules directly coupled to the automatic factory interface, the one or more wafer cleaning modules configured to automatically clean the one or more of the wafer carriers, the one or more wafer carrier cleaning modules further including:
one or more surface characterization tools to detect one or more surface characteristics of the one or more wafer carriers; and
one or more storage areas for the one or more wafer carriers, wherein the one or more storage areas comprise: a first storage area for damaged wafer carriers, a second storage area for wafer carriers that are ready to be cleaned, a third storage area for cleaned wafer carriers after they have been cleaned in the one or more wafer carrier cleaning modules, and a fourth storage area that contains replacement wafer carriers that can be used to replace the damaged wafer carriers that are stored in the first storage area; and
a process cluster operably coupled to the second end of the transfer chamber, the process cluster comprising one or more processing modules;
wherein the one or more wafer carrier cleaning modules further include a wafer carrier cleaning robot;
wherein the first and second storage areas are located on one side of the wafer carrier cleaning robot and the third and fourth storage areas are located on another side of the wafer carrier cleaning robot.
2. The chemical vapor deposition system of claim 1 , wherein the process cluster includes a process cluster robot configured to manipulate the one or more wafer carriers into and out of the transfer chamber.
3. The chemical vapor deposition system of claim 1 , wherein the one or more wafer carrier cleaning modules comprises two or more wafer carrier cleaning modules.
4. The chemical vapor deposition system of claim 1 , wherein the automatic factory interface robot is configured to manipulate the one or more wafer carriers directly into and out of the one or more wafer carrier cleaning modules.
5. The chemical vapor deposition system of claim 1 , wherein one or more of the storage areas of the one or more storage areas further includes a cooling station.
6. The chemical vapor deposition system of claim 1 , wherein the one or more surface characterization tools detect whether the one or more wafer carriers are damaged wafer carriers for placement in the first storage area of acceptable wafer carriers for placement in the second storage area.
7. The chemical vapor deposition system of claim 1 , further including one or more front opening universal pods along a front edge of the automatic factory interface.
8. The chemical vapor deposition system of claim 1 , wherein at least one of the one or more wafer carrier cleaning modules includes:
one or more injector modules for injecting one or more cleaning gases into the one or more wafer carrier cleaning modules; and
an exhaust aperture for routing the cleaning gases out of the one or more wafer carrier cleaning modules.
9. The chemical vapor deposition system of claim 8 , wherein the one or more injector modules each includes a cooling channel and the at least one wafer carrier cleaning module includes a heater that comprises an array of radio frequency heating coils.
10. The chemical vapor deposition system of claim 1 , further including:
one or more purge injectors for injecting an inert purge gas into the one or more wafer carrier cleaning modules;
exhaust dilution apertures that are configured for routing the gases out of the one or more wafer carrier cleaning modules.
11. The chemical vapor deposition system of claim 1 , wherein the one or more surface characterization tools is selected from a group consisting of: pyrometers, surface emissivity monitors, thermal imaging devices, surface x-ray analyzers, ultrasonic sensors, optical measuring systems, photometric systems, photoluminescence spectroscopes, x-ray diffraction devices, eddy current measurement tools, and surface defectivity macro inspection tools.
12. The chemical vapor deposition system of claim 1 , wherein the one or more surface characterization tools are configured to detect cracks in the one or more wafer carriers, and in the event that one or more wafer carriers include detected cracks, the one or more cracked wafer carriers are delivered to the first storage area.