IP Library › Granted Patent US 803,283
Granted Patent S1
US 803,283 · App. 29/564,740 · Granted Nov 21, 2017

Wafer handling assembly

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Quick Facts
Patent No.
US 803,283
App. No.
29/564,740
Granted
Nov 21, 2017
Kind
S1
Claims (1)

The ornamental design for a wafer handling assembly, as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →
PATENT SECURITY AGREEMENT Recorded Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2016
From: RASHKOVSKY, YULIY; SNOWDEN, BRETT STUART; SALDANA, MIGUEL ANGEL
To: VEECO INSTRUMENTS INC.
Reel/Frame 038772/0773 →