Patent Assignment
Reel/Frame 032523/0745
Assignment of Assignor's Interest
Recorded: 2014-03-25
Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2013-08-05
Assignees
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(7)
Method and Structure for Joining Two Substrates with a Low Melt Solder Joint
Patent:
6,583,517 →
Application:
10/119,491 →
Method for Slowing Down Dopant-Enhanced Diffusion in Substrates and Devices Fabricated Therefrom
Thermo-Compression Bonded Electrical Interconnect Structure and Method
Laser Annealing for 3-D Chip Integration
High Surface Area Aluminum Bond Pad for Through-Wafer Connections to an Electronic Package
Integrated Chip Carrier with Compliant Interconnects
Injection Molded Solder Ball Method
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →