Thermo-compression bonded electrical interconnect structure and method
View Patent ↗An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.
1. An electrical structure comprising:
a first substrate comprising a first electrically conductive pad formed within said first substrate, wherein said first electrically conductive pad comprises a first material layer formed over and in contact with a second material layer, and wherein said first material layer comprises a different material from said second material layer;
a second substrate comprising a second electrically conductive pad formed within said second substrate, wherein said second electrically conductive pad comprises a third material layer formed over and in contact with a fourth material layer, and wherein said third material layer comprises a different material from said fourth material layer; and
an interconnect structure electrically and mechanically connecting said first electrically conductive pad to said second electrically conductive pad, wherein said interconnect structure comprises a non-solder metallic core structure, wherein a first portion of said non-solder metallic core structure is thermo-compression bonded to said first electrically conductive pad, and wherein a second portion of said non-solder metallic core structure is thermo-compression bonded to said second electrically conductive pad.
2. The electrical structure of claim 1 , wherein said non-solder metallic core structure comprises a spherical shape.
3. The electrical structure of claim 1 , wherein said non-solder metallic core structure comprises a first metallic structure and a second metallic structure covering and in direct mechanical contact with an entire exterior surface of said first metallic structure, wherein said second metallic structure completely surrounds said first metallic structure, wherein said first metallic structure comprises a first metallic material, wherein said second metallic structure comprises a second metallic material that differs from the first metallic material, wherein said first portion of said non-solder metallic core structure is located on said second metallic structure, and wherein said second portion of said non-solder metallic core structure is located on second metallic structure.
4. The electrical structure of claim 1 , wherein said second material layer comprises a first plurality of layers, and wherein each layer of said first plurality of layers are selected from the group consisting of titanium/copper, chromium/copper, titanium/nickel, and vanadium/copper.
5. The electrical structure of claim 1 , wherein said fourth material layer comprises a first plurality of layers, and wherein each layer of said first plurality of layers are selected from the group consisting of titanium/copper, chromium/copper, titanium/nickel, and vanadium/copper.
6. The electrical structure of claim 3 , wherein said first material layer comprises a same material as said second metallic structure.
7. The electrical structure of claim 3 , wherein said third material layer comprises a same material as said second metallic structure.
8. The electrical structure of claim 3 , wherein said first metallic structure comprises gold, and wherein said second metallic structure comprises copper.