Apparatus and method for die stack flux removal

1. A method for treating a substrate that has openings formed therein, comprising the steps of:

wetting the substrate with a first fluid by positioning the substrate within a first immersion bath for filling the openings in the substrate with the first fluid; and

spraying the wetted substrate with a spray nozzle device that discharges a second fluid, wherein the spray nozzle device is configured such that a spray nozzle arm thereof is formed at an angle less than 45 degrees relative to a reference plane for discharging the second fluid towards the openings in the wetted substrate, wherein the reference plane is parallel to a ground surface.

2. The method of claim 1 , further including the steps of:

rinsing the sprayed substrate with a third fluid;

immersing the rinsed substrate in a fourth fluid contained in a second immersion bath; and

spin drying the substrate after removal of the substrate from the second immersion bath.

3. The method of claim 2 , wherein the third fluid comprises a low clean surface tension fluid.

4. The method of claim 2 , wherein the third fluid and the fourth fluid are the same.

5. The method of claim 2 , wherein the step of spin drying the substrate comprises emitting N2 gas that is oriented toward the substrate for drying the substrate.

6. The method of claim 2 , further including an optional hot plate\N2 purge for drying the substrate.

7. The method of claim 1 , wherein the spray nozzle arm is formed at an angle of 30 degrees relative to the horizontal reference plane.

8. The method of claim 1 , wherein the substrate comprises at least two dies, each die having a plurality of interconnect devices along with flux between adjacent dies.

9. The method of claim 8 , wherein the interconnect devices comprises at least one of: pillars, solder bumps, and metal pads.

10. The method of claim 8 , wherein each of the first fluid and the second fluid is selected to remove the flux.

11. The method of claim 8 , wherein the substrate comprises a stack of 4 or more dies, each die having a plurality of interconnect devices along with flux between adjacent dies.

12. The method of claim 1 , wherein the spray nozzle device is disposed laterally from the substrate and the spray nozzle device is configured to laterally move in a direction toward the substrate and laterally away from the substrate.

13. The method of claim 1 , wherein the openings have a size of 20 microns or less.

14. The method of claim 1 , wherein the spray nozzle device is located at a spin station that is configured to receive the wetted substrate, the spray nozzle device being configured to operate in both: (1) a first mode that is a high pressure mode in which the second fluid is discharged at high pressure up to 3000 psi and (2) a second mode that is a low pressure mode in which the second fluid is discharged at low pressure up to 60 psi.

15. The method of claim 1 , further including the step of:

spinning the substrate; and

operating the spray nozzle device in arm scan mode in which the spray nozzle device moves across the substrate from one edge of the substrate to an opposite edge of the substrate and reversing a spin direction of the substrate.

16. The method of claim 15 , wherein an RPM value of the spinning substrate is varied and the spray nozzle device is operated at a lower pressure that is less than 60 psi and a high volume that is greater than 1 LPM.

17. A system for removing flux from openings formed in a substrate that has openings formed therein comprising:

a spray nozzle device that has a spray nozzle arm that is formed at an angle of less than 45 degrees relative to a horizontal reference plane for discharging fluid towards the openings in the substrate for flux removal, wherein the reference plane is parallel to a ground surface.

18. The system of claim 17 , wherein the angle is 30 degrees.

19. The system of claim 17 , wherein the spray nozzle device is configured to move linearly in a direction towards and away from the substrate.

20. The system of claim 17 , wherein the spray nozzle device is located at a spin station that is configured to receive the wetted substrate, the spray nozzle device being configured to operate in both: (1) a first mode that is a high pressure mode in which the fluid is discharged at high pressure up to 3000 psi and (2) a second mode that is a low pressure mode in which the fluid is discharged at low pressure up to 60 psi.