IP Library › Granted Patent US 858,469
Granted Patent S1
US 858,469 · App. 29/641,930 · Granted Sep 3, 2019

Chemical vapor deposition wafer carrier with thermal cover

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Quick Facts
Patent No.
US 858,469
App. No.
29/641,930
Granted
Sep 3, 2019
Kind
S1
Claims (1)

The ornamental design for a chemical vapor deposition wafer carrier with thermal cover, as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →
PATENT SECURITY AGREEMENT Recorded Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2019
From: KRISHNAN, SANDEEP; RASHKOVSKY, YULIY; GURARY, ALEXANDER; CHIN, LEO; DESHPANDE, MANDAR
To: VEECO INSTRUMENTS INC.
Reel/Frame 048790/0713 →