IP Library Granted Patent US 6,819,000
Granted Patent Utility
US 6,819,000 · Confirmation No. 7266

HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD

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2004-08-12 1449 List of References cited by applicant and considered by examiner 1 View
2004-08-12 892 List of references cited by examiner 1 View
2004-08-12 SPEC Specification 1 View
2004-08-12 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
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2004-07-28 SRNT Examiner's search strategy and results 1 View
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2003-10-23 TRNA Transmittal of New Application 2 View
2003-10-23 SPEC Specification 6 View
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2003-10-23 ABST Abstract 1 View
2003-10-23 REM Applicant Arguments/Remarks Made in an Amendment 3 View
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Quick Facts
Patent No.
US 6,819,000
App. No.
10/692,065
Filed
2003-10-23
Granted
2004-11-16
Pub. No.
US20040084782A1
Examiner
NHU, DAVID
Art Unit
2818
PTA
0 days