IP Library › Granted Patent US 6,819,566
Granted Patent Utility
US 6,819,566 · App. 10/605,752

Grounding and thermal dissipation for integrated circuit packages

Inventors: David Danovitch, Eric Duchesne
Patented Case View Patent ↗
Granted: Nov 16, 2004 Filed: Oct 23, 2003
Inventors
David Danovitch
Eric Duchesne
Assignee (at issue)
International Business Machines Corporation

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Quick Facts
Patent No.
US 6,819,566
App. No.
10/605,752
Filed
2003-10-23
Granted
2004-11-16
Kind
B1