Patent Assignment
Reel/Frame 028867/0216
Assignment of Assignor's Interest
Recorded: 2012-08-29
Pages: 27
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2012-07-18
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(40)
Flip-Chip Interconnections Using Lead-Free Solders
Patent:
6,224,690 →
Application:
08/614,984 →
Method to Plate C4 to Copper Stud
Patent:
6,251,528 →
Application:
09/004,808 →
Interconnection Structure and Process for Module Assembly and Rework
Patent:
6,235,996 →
Application:
09/014,804 →
Lead Free Conductive Composites for Electrical Interconnections
Patent:
6,197,222 →
Application:
09/119,569 →
Flip Chip C4 Extension Structure and Process
Patent:
6,225,206 →
Application:
09/309,405 →
Reflow of Low Melt Solder Tip C4'S
Patent:
6,258,703 →
Application:
09/359,061 →
Dual-Solder Flip-Chip Solder Bump
Lead-Free Alloys for Column/Ball Grid Arrays, Organic Interposers and Passive Component Assembly
Method for Forming C4 Connections on Integrated Circuit Chips and the Resulting Devices
Blm Structure for Application to Copper Pad
Method of Fabricating a Bga Package Having Decreased Adhesion
Structure and Method for Stress Reduction in Flip Chip Microelectronic Packages Using Underfill Materials with Spatially Varying Properties
Structure and Method to Gain Substantial Reliability Improvements in Lead-Free Bgas Assembled with Lead-Bearing Solders
Ball Grid Array Package Construction with Raised Solder Ball Pads
Process for Making Interconnect Solder Pb-Free Bumps Free from Organo-Tin/Tin Deposits on the Wafer Surface
Compressible Films Surrounding Solder Connectors
Techniques for Forming Interconnects
Solder Interconnect Pads with Current Spreading Layers
Through Substrate Annular via Including Plug Filler
Solder Mold Plates Used in Packaging Process and Method of Manufacturing Solder Mold Plates
Interconnections for Flip-Chip Using Lead-Free Solders and Having Reaction Barrier Layers
Interconnections for Flip-Chip Using Lead-Free Solders and Having Reaction Barrier Layers
Through Substrate via Including Variable Sidewall Profile
Optimal Tungsten Through Wafer via and Process of Fabricating Same
Techniques for Arranging Solder Balls and Forming Bumps
Apparatus for Removing Interconnects to Separate Two Parts of a Workpiece
Through Silicon via and Method of Fabricating Same
Vertical Through-Silicon via for a Semiconductor Structure
Programmable Through Silicon Via
Novel Structure of Ubm and Solder Bumps and Methods of Fabrication
Techniques for Arranging Solder Balls and Forming Bumps
Techniques for Arranging Solder Balls and Forming Bumps
Interconnection for Flip-Chip Using Lead-Free Solders and Having Improved Reaction Barrier Layers
Grain Refinement by Precipitate Formation in Pb-Free Alloys of Tin
Through Silicon via Lithographic Alignment and Registration
Structure and Method to Gain Substantial Reliability Improvements in Lead-Free Bgas Assembled with Lead-Bearing Solders
Wafer Level Integrated Interconnect Decal and Manufacturing Method Thereof
Method of Ball Grid Array Package Construction with Raised Solder Ball Pads
Solder Interconnect Pads with Current Spreading Layers
Programmable Through Silicon Via
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Names of Inventors Hariklia Deligianni and Wilma Jean Horkans Inadvertently Combined and Recorded as One. Previously Recorded on Reel 007916 Frame 0375. Assignor(S) Hereby Confirms the Names of Two of the Conveying Party(Ies) as Hariklia Deligianni and Wilma Jean Horkans.
Dec 16, 2009
From: ANDRICACOS, PANAYOTIS C; DATTA, MADHAV; DELIGIANNI, HARIKLIA; HORKANS, WILMA JEAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 023660/0250 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →