IP Library › Granted Patent US 7,819,376
Granted Patent B2
US 7,819,376 · App. 11/930,269 · Granted Oct 26, 2010

Techniques for forming interconnects

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Quick Facts
Patent No.
US 7,819,376
App. No.
11/930,269
Granted
Oct 26, 2010
Kind
B2
Abstract

A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

Claims (48)

1. An apparatus for forming interconnects onto attachment points of a wafer, comprising:

a mold with a plurality of cavities having a predetermined shape;

a release agent disposed on surfaces of said cavities;

said cavities being filled with an interconnect material to form said interconnects;

a source of electromagnetic energy to cause said release agent to be removed from said mold, said source of electromagnetic energy having at least one wavelength which induces at least one of a chemical and a physical change in said release agent; and

a holder for holding said mold adjacent said wafer for attaching said interconnects to said attachment points of said wafer.

2. The apparatus of claim 1 , wherein said mold is formed with a coating in at least said cavities, said release agent being formed over said coating.

3. The apparatus of claim 1 , wherein said release agent comprises a polymer.

4. The apparatus of claim 3 , wherein said polymer is deposited via one of spinning, spraying, vapor deposition and dipping.

5. The apparatus of claim 1 , wherein said mold is formed from a material substantially transparent to laser light, and wherein said source of electromagnetic energy comprises a laser configured to impinge said laser light on said release agent through said mold so as to cause said release agent to release from said surfaces.

6. The apparatus of claim 1 , wherein said mold is formed from a material substantially transparent to ultraviolet light, and wherein said source of electromagnetic energy comprises a source of ultraviolet light configured to impinge said ultraviolet light on said release agent through said mold so as to cause said release agent to release from said surfaces.

7. The apparatus of claim 1 , wherein said release agent is formulated to remain bonded to said interconnects when removed from said mold.

8. The apparatus of claim 1 , wherein said release agent is formulated to be readily removable from said interconnects.

9. The apparatus of claim 1 , wherein said release agent is formulated to be temporarily adherent to said interconnects for protection.

10. The apparatus of claim 1 , wherein said interconnect material comprises one of solder, copper and a composite interconnect material.

11. The apparatus of claim 1 , further comprising an adhesive layer deposited on said mold.

12. The apparatus of claim 11 , wherein said release agent and said adhesive are realized in a multilayer polymer system.

13. The apparatus of claim 1 , wherein said interconnects are generally column-shaped.

14. In combination:

a wafer having a plurality of attachment points; and

an apparatus for forming interconnects onto said attachment points of said wafer, said apparatus in turn comprising:

a mold with a plurality of cavities having a predetermined shape;

a release agent disposed on surfaces of said cavities;

said cavities being filled with an interconnect material to form said interconnects; and

a source of electromagnetic energy to cause said release agent to be removed from said mold, said source of electromagnetic energy having at least one wavelength which induces at least one of a chemical and a physical change in said release agent, said mold being adjacent said wafer for attaching said interconnects to said attachment points of said wafer.

15. The combination of claim 14 , wherein said mold is formed with a coating in at least said cavities, said release agent being formed over said coating.

16. The combination of claim 14 , wherein said release agent comprises a polymer.

17. The combination of claim 16 , wherein said polymer is deposited via one of spinning, spraying, vapor deposition and dipping.

18. The combination of claim 14 , wherein said mold is formed from a material substantially transparent to laser light, and wherein said source of electromagnetic energy comprises a laser configured to impinge said laser light on said release agent through said mold so as to cause said release agent to release from said surfaces.

19. The combination of claim 14 , wherein said mold is formed from a material substantially transparent to ultraviolet light, and wherein said source of electromagnetic energy comprises a source of ultraviolet light configured to impinge said ultraviolet light on said release agent through said mold so as to cause said release agent to release from said surfaces.

20. The combination of claim 14 , wherein said release agent is formulated to remain bonded to said interconnects when removed from said mold.

21. The combination of claim 14 , wherein said release agent is formulated to be readily removable from said interconnects.

22. The combination of claim 14 , wherein said release agent is formulated to be temporarily adherent to said interconnects for protection.

23. The combination of claim 14 , wherein said interconnect material comprises one of solder, copper and a composite interconnect material.

24. An apparatus for forming interconnects onto attachment points of a wafer, comprising:

a mold with a plurality of cavities having a predetermined shape;

a release agent disposed on surfaces of said cavities;

said cavities being filled with an interconnect material to form said interconnects;

a source of energy to cause said release agent to be removed from said mold; and

a holder for holding said mold adjacent said wafer for attaching said interconnects to said attachment points of said wafer;

wherein said release agent is formulated to remain bonded to said interconnects when removed from said mold.

25. An apparatus for forming interconnects onto attachment points of a wafer, comprising:

a mold with a plurality of cavities having a predetermined shape;

a release agent disposed on surfaces of said cavities;

said cavities being filled with an interconnect material to form said interconnects;

a source of energy to cause said release agent to be removed from said mold; and

a holder for holding said mold adjacent said wafer for attaching said interconnects to said attachment points of said wafer;

wherein said release agent is formulated to be temporarily adherent to said interconnects for protection.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →