Techniques for arranging solder balls and forming bumps
View Patent ↗A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.
1. A method comprising the steps of:
providing an electrically resistive mold having a plurality of cavities;
dispensing conductive balls into said cavities, substantially one ball to each cavity, by charging said balls to a first polarity and said mold to a second polarity different than said first polarity;
aligning said conductive balls with pads of a semiconductor device; and
transferring said conductive balls to said pads by fluxless reflow in a formic acid environment.
2. The method of claim 1 , wherein said conductive balls comprise solder balls with a liquidus temperature of at least about 250 degrees Centigrade.
3. The method of claim 2 , wherein said mold is formed of one of silicon and glass.
4. The method of claim 3 , wherein said mold further comprises an insulating oxide layer.
5. The method of claim 2 , wherein said charging of said mold comprises rubbing with a cloth.
6. The method of claim 2 , wherein said charging of said mold is carried out with an ion generator.
7. The method of claim 1 , wherein said mold further comprises keep-out zones between said cavities, further comprising the additional step of charging said keep-out zones to repel said balls.
8. The method of claim 2 , further comprising the additional step of keeping said mold substantially discharged and tied to one of a common potential and ground when not holding or attracting said solder balls.