IP Library › Granted Patent US 6,596,621
Granted Patent Utility Small
US 6,596,621 · Confirmation No. 4850

METHOD OF FORMING A LEAD-FREE TIN-SILVER-COPPER BASED SOLDER ALLOY ON AN ELECTRONIC SUBSTRATE.

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2025-10-20 OATH Oath or Declaration filed 52 View
2025-07-15 OATH Oath or Declaration filed 63 View
2025-06-16 OATH Oath or Declaration filed 43 View
2015-01-15 IMIS Miscellaneous Internal Document 1 View
2010-03-18 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2002-05-17 TRNA Transmittal of New Application 1 View
2002-05-17 SPEC Specification 14 View
2002-05-17 CLM Claims 6 View
2002-05-17 ABST Abstract 1 View
2002-05-17 DRW Drawings-only black and white line drawings 2 View
2002-05-17 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,596,621
App. No.
10/151,075
Filed
2002-05-17
Granted
2003-07-22
Art Unit
2813
PTA
0 days