Patent Assignment
Reel/Frame 012923/0648
Assignment of Assignor's Interest
Recorded: 2002-05-17
Pages: 3
Assignors
COPELAND, BRUCE ANTHONY
Executed: 2002-05-03
GORRELL, REBECCA YUNG
Executed: 2002-05-16
TAKACS, MARK ANTHONY
Executed: 2002-05-03
TRAVIS, KENNETH J., JR.
Executed: 2002-05-03
WANG, JUN
Executed: 2002-05-03
WIGGINS, LOVELL E.
Executed: 2002-05-08
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Forming a Lead-Free Tin-Silver-Copper Based Solder Alloy on an Electronic Substrate.
Patent:
6,596,621 →
Application:
10/151,075 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 13, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028959/0001 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →